On site equipment:
Wedge bonding (Al/Au 17μm)
Optical microscope (x5 to x100) + CCD camera
Binocular
Test-head probe station
Oven for cleaning/annealing under controlled atmosphere (up to 1200 °C)
AFM (tapping topography mode)
Vector signal source and analyzer (1MHz – 3 GHz, bandwidth 40MHz)
Clean room processes, in collaboration with AIME and LPCNO: soft plasma cleaner, wafer dicing, metallic thin film deposition, e-beam lithography, chemical cleaning etc…